| Optimized Photoinitiator Package |
Improved response to technological advancements
Enhanced production efficiency |
| NVP-Free Product |
Reduced health related issues |
| Superior flexibility |
No cracking, chipping or tearing when embossing or die cutting
Can be utilized for IMD projects |
| Excellent Opacity |
Reduced number of passes
Achieve hide/opacity quicker |
| Adhesive Resistant |
No specialized adhesives needed |
| Light Fast Pigmentation |
Ink can be utilized for all types of jobs |